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Laser Direct Structuring

3D MIDs – attractive and compact

Pigments of the Iriotec® 8000 Series enable laser direct structuring even on light-colored components
Light-colored plastic components and powder-coated metal parts are transformed into 3D mechatronic integrated devices (3D MIDs) – all thanks to the light-colored and temperature-stable laser-sensitive pigment products of EMD Performance Materials's Iriotec® 8000 Series. The process behind it is laser direct structuring, developed by LPKF Laser & Electronics AG. The limits put on the color and design of 3D MIDs by dark-colored materials are a thing of the past: The innovative pigments now offer designers and product developers a new variety of design options.
Laser direct structuring
  • enables selective metallization for three-dimensional circuit boards
  • connects electronic circuits directly to the work piece
  • unlocks new design options
  • reduces product development and production times
  • saves costs by reducing the amount of material needed
Iriotec® 8000 laser pigments
  • enable 3D MIDs made from light-colored plastics or light-colored powder-coated components thanks to their light masstone
  • allow metallization of a wide variety of polymers and powder coatings with finer structures
  • facilitate design creativity
  • permit new freedom in the color design of electronic devices
3D-MIDs 
  • reduce material expenditure, as the component itself becomes the circuit board
  • decrease the size and weight of electronic products and support miniaturization through high density of functionality
  • save production costs
  • protect the environment through the use of recyclable thermoplastics
The laser direct structuring process is patent-protected by LPKF Laser & Electronics AG. Customers who want to use the pigments of the Iriotec® 8000 Series for this process are requested to contact LPKF Laser & Electronics AG to acquire a process license and to adhere to the patents held by other material manufacturers with regard to the specific polymer composition required in each case.

Discover the benefits of Iriotec® 8000 for laser direct structuring.
 

Heat-resistant and invisible until activated by laser light

The entire Iriotec® 8000 portfolio for direct structuring at a glance 
Laser-sensitive pigments of the product range Iriotec® 8000 allow plastic parts and powder-coated metals to be transformed into three-dimensional mechatronic integrated devices – whatever their shape or color. 
  • Their outstanding heat resistance makes all three products suitable for plastics processed at high temperatures.
  • Thanks to their light masstone, they remain subtly in the background and let design and color take center stage.
Iriotec® 8825 – a light-colored pigment based on mica and tin antimony oxide, especially suitable for use in glass fiber-reinforced polymers.

Iriotec® 8841 – a light-green-colored pigment based on copper phosphate and tin oxide, characterized by excellent metallization behavior and metal adhesion.

Iriotec® 8850 – a light-colored pigment based on titanium dioxide and tin antimony oxide, also suitable for laser direct structuring of powder coatings  
 
Iriotec® 8825Iriotec® 8841Iriotec® 8850
Chemical compositionMica, tin antimony oxideCopper phosphate, tin oxide, inorganic auxiliariesTitanium dioxide, tin antimony oxide
ColorLight-colored pigmentLight-green-colored pigmentLight-colored pigment
Temperature stabilityUp to 800 °CUp to 400 °CUp to 800 °C
Particle size< 10 µm< 10 µm< 1 µm
AdvantagesSuitable for all polymers including high-temperature polymersSuitable for high-temperature polymers; additional stabilization is recommendedSuitable for all polymers including high-temperature polymers
Recommended for glass fiber-reinforced polymersRecommended for glass fiber-reinforced polymersRecommended for powder coatings
Allows metallization, maintains the mechanical strength of the polymerVery good metallization and metal adhesionVery good metallization and metal adhesion
The typical data above serve to generally characterize the pigment. These values are not meant as specifications and they do not have binding character. The product specifications are available separately, on request.
 
Use Materials in the menu bar above to find out which product is best suited to your needs. You can find out more about the production of 3D MIDs with Iriotec® 8000 pigments in the menu bar above under Process steps.

Our portfolio of laser-sensitive pigments for direct structuring:
Article No.NamePackage sizes
104783Iriotec® 88251 kg and 20 kg*
141434Iriotec® 88411 kg and 25 kg*
141414Iriotec® 88501 kg and 25 kg*

 * Sample quantities available on request.

You can also find all the key information in our brochure.

Do you want specific information on our Iriotec® 8000 products? We would be delighted to hear from you: Contact 

 

Produce – activate – metallize

Three steps to 3D MID with Iriotec® 8000 laser pigments
For a long time, circuit boards lived up to their name – they were flat, two-dimensional boards. At first, their three-dimensional descendants could only be made from dark-colored materials. The combination of Iriotec® 8000 laser pigments from EMD Performance Materials and a process developed and patented by LPKF Laser & Electronics AG now also enables the production of light-colored and colored 3D MIDs. With their light masstone, the pigments do not change the look of plastics or coatings, allowing a huge variety of colors and designs. Their heat resistance also makes them a reliable partner in thermoplastic processes.
 

How it works:

Step 1: Production
The work piece is made. An injection molding process is used to produce plastic parts from polymers into which Iriotec® 8000 laser pigments are integrated. Or the parts are made from metal and then finished with a powder coating made from materials into which Iriotec® 8000 laser pigments are also integrated.

Step 2: Laser activation
A laser beam draws the circuit layout on the surface, activating the laser pigments. The reaction with the laser light forms metal seeds, roughening the surface at a microscopic level. 

Step 3: Metallization
The work piece is dipped into a copper bath. The conductive paths are formed on the marked areas and metal seeds. The board is usually then galvanically reinforced with nickel and gold. Application-specific coatings such as tin, silver, palladium/gold and an organic solderability preservative (OSP) can also be applied during this third process step. 

Further processing:
The 3D MID components can now be subjected to conventional further processing: soldering, bonding, holding, processing with soldering pastes, etc. 

You can find out more about the particular benefits of the individual pigments in the menu bar above under Products.

Do you want specific information on laser direct structuring with our Iriotec® 8000 products? We would be delighted to hear from you: Contact 
 

Function follows form

LDS with Iriotec® 8000 pigments puts the look of electronic components in center stage – for a wide range of applications  
Laser pigments of the Iriotec® 8000 Series make history of the old design principle that the form has to adapt to the function: The functional particles and the process developed and patented by LPKF Laser & Electronics AG give circuit boards a third dimension – for innovative 3D MIDs whose color, form and size match the look of the entire product.

The benefits of 3D MIDs:
  • Products can become smaller and lighter
  • Prototypes can be created more quickly and cost-effectively
  • The product can reach market maturity more quickly
3D MIDs made from light-colored plastics or on light-colored, powder-coated components carry a huge amount of innovation potential for many fields of electronics.

 

Electro-fingers

The laser direct structuring process is patent-protected by LPKF Laser & Electronics AG. Customers who want to use the pigments in the Iriotec® 8000 series for this process are requested to contact LPKF Laser & Electronics AG to acquire a process license and to adhere to the patents held by other material manufacturers with regard to the specific polymer composition required in each case.